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Camtek Unveils Gryphon SL – its 3D Functional Inkjet Technology System

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Israel’s Camtek Ltd., which provides automated and technologically advanced solutions in the Semiconductors, Printed Circuit Boards (PCB) and IC Substrates industries, announced that it will launch the Gryphon SL at the IPC APEX EXPO in San Diego.

Gryphon SL is the latest innovation of Camtek’s 3D functional inkjet technology system, enabling a one-stop-shop process for both Solder Mask and Legend deposition by 3D inkjet technology.

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This new system, the company says, is designed to replace both the traditional solder mask and the legend deposition processes in the manufacture of Printed Circuit Boards (PCB). Gryphon SL enhances production by significantly improving the accuracy, reliability and yield of the process, while reducing manpower needs and eliminating the need to treat waste products from the process.

Camtek will unveil the Gryphon SL at the IPC APEX EXPO and will give live demonstrations of the system’s capabilities showing a full cycle of solder mask deposition and legend printing.

Rafi Amit, Chairman and CEO of Camtek, commented, “I am very excited to unveil our latest and enhanced 3D functional inkjet system, the Gryphon SL at the IPC APEX EXPO. The serious interest we have seen from potential customers leaves us with no doubt that the system brings a significant innovation to the PCB manufacturing industry. Gryphon SL is a huge leap forward in the digitalization of traditional PCB manufacturing processes and is designed to enhance production, reliability and yield at lower overall cost and zero waste.”

Dr. Boaz Nitzan, Vice President of Camtek’s Functional Inkjet Technologies (FIT) Division added, “Gryphon SL was designed and developed with a long-term vision that keeps in pace with the PCB market roadmap and meets the most demanding manufacturing requirements and standards. I am confident that by combining both the Solder Mask and Legend processes on the same system we will significantly change the PCB manufacturing landscape. We intend to continue our innovative solutions’ development for the PCB manufacturing process with our breakthrough technologies.”

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